Principles Of Plasma Discharges And Materials Processing

Author: Michael A. Lieberman
Publisher: John Wiley & Sons
ISBN: 0471724246
Size: 27.70 MB
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A Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.

Principles Of Plasma Discharges And Materials Processing

Author: Michael A. Lieberman
Publisher: Wiley-Interscience
ISBN: 9780471720010
Size: 21.48 MB
Format: PDF, Mobi
View: 1587
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A Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.

Principles Of Plasma Discharges And Materials Processing

Author: Michael A. Lieberman
Publisher: Wiley-Interscience
ISBN: 9780471005773
Size: 72.85 MB
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Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource. In-depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results

Lecture Notes On Principles Of Plasma Processing

Author: Francis F. Chen
Publisher: Springer Science & Business Media
ISBN: 1461501814
Size: 10.22 MB
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Plasma processing of semiconductors is an interdisciplinary field requiring knowledge of both plasma physics and chemical engineering. The two authors are experts in each of these fields, and their collaboration results in the merging of these fields with a common terminology. Basic plasma concepts are introduced painlessly to those who have studied undergraduate electromagnetics but have had no previous exposure to plasmas. Unnecessarily detailed derivations are omitted; yet the reader is led to understand in some depth those concepts, such as the structure of sheaths, that are important in the design and operation of plasma processing reactors. Physicists not accustomed to low-temperature plasmas are introduced to chemical kinetics, surface science, and molecular spectroscopy. The material has been condensed to suit a nine-week graduate course, but it is sufficient to bring the reader up to date on current problems such as copper interconnects, low-k and high-k dielectrics, and oxide damage. Students will appreciate the web-style layout with ample color illustrations opposite the text, with ample room for notes. This short book is ideal for new workers in the semiconductor industry who want to be brought up to speed with minimum effort. It is also suitable for Chemical Engineering students studying plasma processing of materials; Engineers, physicists, and technicians entering the semiconductor industry who want a quick overview of the use of plasmas in the industry.

Glow Discharge Processes

Author: Brian Chapman
Publisher: Wiley-Interscience
ISBN:
Size: 27.77 MB
Format: PDF, Kindle
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Develops detailed understanding of the deposition and etching of materials by sputtering discharge, and of etching of materials by chemically active discharge. Treats glow discharge at several levels from basic phenomena to industrial applications--practical techniques diligently related to fundamentals. Subjects range from voltage, distributions encountered in plasma etching systems to plasma-electron interactions that contribute to sustaining the discharge.

Principles Of Plasma Diagnostics

Author: I. H. Hutchinson
Publisher: Cambridge University Press
ISBN: 9780521675741
Size: 63.48 MB
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This book provides a systematic introduction to the physics behind measurements on plasmas. It develops from first principles the concepts needed to plan, execute, and interpret plasma diagnostics. The book is therefore accessible to graduate students and professionals with little specific plasma physics background, but is also a valuable reference for seasoned plasma physicists. Most of the examples are taken from laboratory plasma research, but the focus on principles makes the treatment useful to all experimental and theoretical plasma physicists, including those interested in space and astrophysical applications. This second edition is thoroughly revised and updated, with new sections and chapters covering recent developments in the field. Specific areas of added coverage include neutral-beam-based diagnostics, flow measurement with mach probes, equilibrium of strongly shaped plasmas and fusion product diagnostics.

Physics Of Radio Frequency Plasmas

Author: Pascal Chabert
Publisher: Cambridge University Press
ISBN: 1139494686
Size: 30.94 MB
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Low-temperature radio frequency plasmas are essential in various sectors of advanced technology, from micro-engineering to spacecraft propulsion systems and efficient sources of light. The subject lies at the complex interfaces between physics, chemistry and engineering. Focusing mostly on physics, this book will interest graduate students and researchers in applied physics and electrical engineering. The book incorporates a cutting-edge perspective on RF plasmas. It also covers basic plasma physics including transport in bounded plasmas and electrical diagnostics. Its pedagogic style engages readers, helping them to develop physical arguments and mathematical analyses. Worked examples apply the theories covered to realistic scenarios, and over 100 in-text questions let readers put their newly acquired knowledge to use and gain confidence in applying physics to real laboratory situations.

Plasma Etching

Author: M. Sugawara
Publisher: OUP Oxford
ISBN: 9780191590290
Size: 68.85 MB
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The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.

Novel Materials Processing By Advanced Electromagnetic Energy Sources

Author: S. Miyake
Publisher: Elsevier
ISBN: 9780080456126
Size: 65.74 MB
Format: PDF, Docs
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Proceedings of the International Symposium in Novel Materials Processing by Advanced Electromagnetic Energy Sources (MAPEES'04) *Identifies and details recent progress achieved by advanced electromagnetic energy sources in materials processing. *Explores novel approaches to advanced electromagnetic energy processing of materials in an attempt to discover new and unique industrial fields.

Plasma Etching

Author: Dennis M. Manos
Publisher: Elsevier
ISBN: 0080924468
Size: 43.51 MB
Format: PDF, ePub, Mobi
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Plasma etching plays an essential role in microelectronic circuit manufacturing. Suitable for researchers, process engineers, and graduate students, this book introduces the basic physics and chemistry of electrical discharges and relates them to plasma etching mechanisms. Throughout the volume the authors offer practical examples of process chemistry, equipment design, and production methods.