Plasma Processing For Vlsi

Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217752
Size: 41.73 MB
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VLSI Electronics: Microstructure Science, Volume 8: Plasma Processing for VLSI (Very Large Scale Integration) discusses the utilization of plasmas for general semiconductor processing. It also includes expositions on advanced deposition of materials for metallization, lithographic methods that use plasmas as exposure sources and for multiple resist patterning, and device structures made possible by anisotropic etching. This volume is divided into four sections. It begins with the history of plasma processing, a discussion of some of the early developments and trends for VLSI. The second section, Deposition, discusses deposition techniques for VLSI such as sputtering metals for metallization and contacts, plasma-enhanced chemical vapor deposition of metals and suicides, and plasma enhanced chemical vapor deposition of dielectrics. The part on Lithography presents the high-resolution trilayer resist system, pulsed x-ray sources for submicrometer x-ray lithography, and high-intensity deep-UV sources. The last part, Etching, provides methods in etching, like ion-beam etching using reactive gases, low-pressure reactive ion etching, and the uses of inert-gas ion milling. The theory and mechanisms of plasma etching are described and a number of new device structures made possible by anisotropic etching are enumerated as well. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.

Vlsi Electronics

Author: Norman G. Einspruch
Publisher: Academic Pr
ISBN: 9780122341021
Size: 24.61 MB
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Vlsi Electronics Microstructure Science

Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217744
Size: 70.16 MB
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VLSI Electronics: Microstructure Science, Volume 7 presents a comprehensive exposition and assessment of the developments and trends in VLSI (Very Large Scale Integration) electronics. This treatise covers subjects that range from microscopic aspects of materials behavior and device performance to the comprehension of VLSI in systems applications. Each chapter is prepared by a recognized authority. The topics contained in this volume include a basic introduction to the application of superconductivity in high-speed digital systems; the expected impact of VLSI technology on the implementation of AI (artificial intelligence); the limits to improvement of silicon integrated circuits; and the various spontaneous noise sources in VLSI circuits and their effect on circuit operation. Scientists, engineers, researchers, device designers, and systems architects will find the book very useful.

Dry Etching For Vlsi

Author: A.J. van Roosmalen
Publisher: Springer Science & Business Media
ISBN: 148992566X
Size: 69.77 MB
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This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.

Plasma Processing Of Semiconductors

Author: Paul Williams
Publisher: Springer Science & Business Media
ISBN: 9401158843
Size: 52.15 MB
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Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.

Vlsi Metallization

Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217817
Size: 60.19 MB
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VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.

Nanofabrication And Biosystems

Author: Harvey C. Hoch
Publisher: Cambridge University Press
ISBN: 9780521462648
Size: 49.52 MB
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This book discusses nano- and microfabrication, and how biologists are using such fabricated devices in their research. The goal of the book is to inform materials scientists and engineers about the needs of biologists, and equally, to inform biologists about how nano- and micro-scale fabrication may help to shed light on their own particular research problems. The book also aims to stimulate innovative, productive interactions between materials scientists, engineers, and biologists; and, to explore ways that materials scientists and engineers can exploit biological principles and biological assemblies to produce new and ever-smaller devices. In addition to serving as a resource for scientists in the field, the book is also intended for any biologist or physical scientist who wishes to understand the current state-of-the-art, and what research is currently being done using biological nanofabrication.

Microelectronic Materials And Processes

Author: Roland Levy
Publisher: Springer Science & Business Media
ISBN: 9400909179
Size: 66.45 MB
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The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

Application Specific Integrated Circuit Asic Technology

Author: Norman G. Einspruch
Publisher:
ISBN: 9780122341236
Size: 20.24 MB
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V. 1-5. [without special title] -- v. 6. Materials and process characterization -- v. 7. [without special title] -- v. 8. Plasma processing for VLSI -- v. 9. [without special title] -- v. 10. Surface and interface effects in VLSI -- v. 11. GaAs microelectronics -- v. 12. Silicon materials -- v. 13. Metal-semiconductor contacts and devices -- v. 14. VLSI design -- v. 15. VLSI metallization -- v. 16. Lithography for VLSI -- v. 17. VLSI in medicine -- v. 18. Advanced MOS device physics -- v. 19. Advanced CMOS process technology -- 20. VLSI and computer architecture -- v. 21. Beam processing technologies -- v. 22. VLSI reliability -- v. 23. Application specific integrated circuit (ASIC) technology -- v. 24. Heterostructures and quantum devices.