Atomic Layer Deposition Ald

Author: Jeannie Valdez
Publisher:
ISBN: 9781634838696
Size: 48.46 MB
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Atomic layer deposition (ALD) is a thin film deposition technique used in the mass production of microelectronics. In this book, novel nonvolatile memory devices are discussed. The chapters examine the low-temperature fabrication process of single-crystal platinum non-thin films using plasma-enhanced atomic layer deposition (PEALD). A comprehensive review of ALD surface coatings for battery systems is provided, as well as a theoretical calculation on the mechanism of thermal and plasma-enhanced atomic layer deposition of SiO2; and fluorine doping behavior in Zn-based conducting oxide film grown by ALD.

Atomic Layer Deposition

Author: Tommi Kääriäinen
Publisher: John Wiley & Sons
ISBN: 1118747380
Size: 27.74 MB
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Since the first edition was published in 2008, Atomic Layer Deposition (ALD) has emerged as a powerful, and sometimes preferred, deposition technology. The new edition of this groundbreaking monograph is the first text to review the subject of ALD comprehensively from a practical perspective. It covers ALD's application to microelectronics (MEMS) and nanotechnology; many important new and emerging applications; thermal processes for ALD growth of nanometer thick films of semiconductors, oxides, metals and nitrides; and the formation of organic and hybrid materials.

Atomic Layer Deposition

Author: Tommi Kääriäinen
Publisher: John Wiley & Sons
ISBN: 1118747380
Size: 38.45 MB
Format: PDF
View: 2908
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Since the first edition was published in 2008, Atomic Layer Deposition (ALD) has emerged as a powerful, and sometimes preferred, deposition technology. The new edition of this groundbreaking monograph is the first text to review the subject of ALD comprehensively from a practical perspective. It covers ALD's application to microelectronics (MEMS) and nanotechnology; many important new and emerging applications; thermal processes for ALD growth of nanometer thick films of semiconductors, oxides, metals and nitrides; and the formation of organic and hybrid materials.

Atomic Layer Deposition For Semiconductors

Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Size: 10.69 MB
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Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications

Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
ISBN: 9780387958682
Size: 32.10 MB
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In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Interlayer Dielectrics For Semiconductor Technologies

Author: Shyam P Muraka
Publisher: Elsevier
ISBN: 9780080521954
Size: 42.55 MB
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Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package. * Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume * written by renowned experts in the field * Provides an up-to-date starting point in this young research field.

Fundamentals Of Industrial Electronics

Author: Bogdan M. Wilamowski
Publisher: CRC Press
ISBN: 1439802807
Size: 54.95 MB
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The Industrial Electronics Handbook, Second Edition combines traditional and newer, more specialized knowledge that will help industrial electronics engineers develop practical solutions for the design and implementation of high-power applications. Embracing the broad technological scope of the field, this collection explores fundamental areas, including analog and digital circuits, electronics, electromagnetic machines, signal processing, and industrial control and communications systems. It also facilitates the use of intelligent systems—such as neural networks, fuzzy systems, and evolutionary methods—in terms of a hierarchical structure that makes factory control and supervision more efficient by addressing the needs of all production components. Enhancing its value, this fully updated collection presents research and global trends as published in the IEEE Transactions on Industrial Electronics Journal, one of the largest and most respected publications in the field. Fundamentals of Industrial Electronics covers the essential areas that form the basis for the field. This volume presents the basic knowledge that can be applied to the other sections of the handbook. Topics covered include: Circuits and signals Devices Digital circuits Digital and analog signal processing Electromagnetics Other volumes in the set: Power Electronics and Motor Drives Control and Mechatronics Industrial Communication Systems Intelligent Systems

Eurocvd 17 Cvd 17

Author: M. T. Swihart
Publisher: The Electrochemical Society
ISBN: 1566777453
Size: 33.38 MB
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This issue of ECS Transactions includes papers presented at the 2009 EuroCVD-17 and CVD 17 symposium. Topical areas covered include fundamentals of chemical vapor deposition (CVD), chemistry of precursors for CVD, synthesis of nanomaterials by CVD and related methods, industrial applications of CVD, and novel CVD reactors and processes. This issue is sold as a two-part set and also includes a CD-ROM of the entire issue.

Atomic Layer Deposition In Energy Conversion Applications

Author: Julien Bachmann
Publisher: John Wiley & Sons
ISBN: 3527694838
Size: 79.47 MB
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Combining the two topics for the first time, this book begins with an introduction to the recent challenges in energy conversion devices from a materials preparation perspective and how they can be overcome by using atomic layer deposition (ALD). By bridging these subjects it helps ALD specialists to understand the requirements within the energy conversion field, and researchers in energy conversion to become acquainted with the opportunities offered by ALD. With its main focus on applications of ALD for photovoltaics, electrochemical energy storage, and photo- and electrochemical devices, this is important reading for materials scientists, surface chemists, electrochemists, electrotechnicians, physicists, and those working in the semiconductor industry.

Atomic Layer Deposition Of Nanostructured Materials

Author: Nicola Pinna
Publisher: John Wiley & Sons
ISBN: 3527639926
Size: 63.22 MB
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Atomic layer deposition, formerly called atomic layer epitaxy, was developed in the 1970s to meet the needs of producing high-quality, large-area fl at displays with perfect structure and process controllability. Nowadays, creating nanomaterials and producing nanostructures with structural perfection is an important goal for many applications in nanotechnology. As ALD is one of the important techniques which offers good control over the surface structures created, it is more and more in the focus of scientists. The book is structured in such a way to fi t both the need of the expert reader (due to the systematic presentation of the results at the forefront of the technique and their applications) and the ones of students and newcomers to the fi eld (through the first part detailing the basic aspects of the technique). This book is a must-have for all Materials Scientists, Surface Chemists, Physicists, and Scientists in the Semiconductor Industry.